TIF500-50-11US Thermal Silicone Pad 5.0W, High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices
The TIF®500-50-11US Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assembly.
Features:
> Good thermal conductivity: 5.0W/mK
> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications
> AI Servers, Inverters, Telecom Devices
> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems
| Typical Properties of TIF®500-50-11US Series |
| Property | Value | Test method |
| Color | Dark Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density(g/cm³) | 3.4 | ASTM D792 |
| Thickness Range(inch/mm) | 0.010~0.020 (0.25~0.50) | 0.030~0.200 (0.75~5.0) | ASTM D374 |
| Hardness | 65 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | *** |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 |
| 5.0 W/m-K | ISO22007 |
Product Specifications
Standard Thickness: 0.010"(0.250 mm)-0.20" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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TIF500-50-11US Thermal Silicone Pad 5.0W, High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices Images
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