Good softness and filling properties Thermally Silicone Pad For AI
The TIF®500-18-11US Series is a universal thermal pad with balanced performance.It provides good thermal conductivity and moderate hardness. This balanced design combines good surface adhesion and excellent operational convenience, providing effective heat transfer paths and basic physical protection for a wide range of electronic components.The ideal choice for addressing the needs of medium to
high power heat dissipation,achieving the best balance between cost and performance.
Features:
> Good thermal conductivity: 1.8W/mK
> Good softness and filling properties
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications
> AI
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures
| Typical Properties of TIF®500-18-11US Series |
| Property | Value | Test method |
| Color | Dark Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density(g/cm³) | 2.5 | ASTM D792 |
| Thickness Range(inch/mm) | 0.010~0.020 (0.25~0.50) | 0.030~0.200 (0.75~5.0) | ASTM D374 |
| Hardness | 65 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | *** |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 4.2 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 1.8 W/m-K | ASTM D5470 |
| 1.8 W/m-K | ISO22007 |
Product Specifications
Standard Thickness: 0.010"(0.250 mm)-0.20" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
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